As semiconductor technology nodes continue to advance to 7nm, 5nm, and smaller sizes, wafer surface cleaning technology faces unprecedented challenges. Traditional wet cleaning processes exhibit growing limitations in removing nanoscale particles and film contaminants, along with issues such as chemical waste disposal and high water consumption. Supercritical wafer cleaning technology provides an innovative solution to these problems by leveraging the unique physicochemical properties of supercritical fluids.
Features of supercritical wafer cleaning technology
Our company has rich experience in supercritical carbon dioxide fluid technology and equipment, and the supercritical wafer cleaning equipment developed has the following characteristics:
Clamp quick opening cleaning groove structure design, and manual bolt locking structure compared with easy to operate;
Independent internal cleaning rack design, can meet the cleaning requirements of different sizes of wafers;
Customized adsorption tower structure design, can adsorb and recover chemical agents;
Customized high clean steel material, to meet the characteristics of semiconductor wafer material requirements;
Feature filter design, high filtration accuracy, to avoid fine particles may harm the wafer;
Full automatic control.
Our company can also customize the design and production of equipment according to the characteristics of customers.
Main technical parameters
| No. |
name
|
Parameter
|
| 1 | The inner diameter of the cleaning tank | 110mm to 400mm |
| 2 |
Wafer cleaning specifications |
4 ", 6 ", 8 "and 12" |
| 3 |
Maximum working pressure |
40MPa |
| 4 |
Maximum temperature |
150℃ |
| 5 |
Material |
High clean steel (EP) |
| 6 |
CO2 filtration accuracy |
Not less than 0.08um |
| 7 |
Control mode |
Fully automatic |
| 8 |
The number of wafers processed |
greater than 5 |
Core Components of Supercritical Wafer Cleaning Equipment
CO₂ Supply System
1.Storage tank (for liquid CO₂)
2.High-pressure pump (pressurizes CO₂ to supercritical state)
3.Heater (maintains supercritical temperature)
01
Cleaning Chamber
1.High-pressure resistant (50 MPa or higher)
2.Wafer holder (secures wafers in place)
3.Fluid nozzles (ensures uniform cleaning)
02
Temperature Control System
1.Heating (maintains supercritical temperature)
2.Cooling (cools the system after the process)
03
Recovery System
1.Separator (separates CO₂ and contaminants)
2.Purification unit (recycles CO₂)
04
Control System
1.Automatically regulates pressure, temperature, and flow rate
2.Monitors the cleaning process
05
Current Applications in Semiconductor Manufacturing
Currently, supercritical wafer cleaning equipment has found initial applications in advanced logic chips and memory manufacturing. Leading global semiconductor manufacturers such as TSMC and Samsung have begun adopting this technology in production lines, primarily for critical-layer cleaning processes.
Supercritical wafer cleaning technology represents the future direction of semiconductor manufacturing cleaning processes. Its superior cleaning performance and significant economic and environmental benefits make it indispensable in addressing the nanoscale cleaning challenges faced by the semiconductor industry. Although there is still room for improvement in terms of equipment cost and process maturity, supercritical cleaning equipment will become a standard feature in advanced semiconductor manufacturing plants as the technology progresses and the industrial ecosystem improves.
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